Manufacturing a variety of different electrical components often requires a process called reflow soldering. In addition to being great DIY components producers, tabletop reflow oven makes up a key portion in the soldering process. The oven is hassle-free for both home and commercial users in terms of installation and operation thanks to its simple bench top design.
Re-flow soldering is most often used to fix surface mounted components onto circuit boards. Through-hole components can be fixed onto the boards using this method as well. In order to ensure accuracy, a paste made from solder and flux is set between the component and contact pad. The combined piece then requires a higher temperature for the paste to meld. In order to do this safely, the piece is put inside this kind of soldering machine.
Cautious care needs to be taken so that the electrical component isn't overheated or damaged, so these machines are utilized to slowly and progressively melt the solder paste into a mold. There are four gradual stages of temperature the machine goes through in total. The device goes from preheating, soaking, re-flow melting, then cooling.
The longest stage of the soldering machine is the first preheating feature. Between 1 to 3 degrees Celsius rises per second through the entire time. This gradual increase by a static number of degrees Celsius is often referred to as ramp-up rate. The ramp-up rate is an important feature the machine offer so that the intensity of heat on the component is safely progressive rather than abrupt.
The second stage after preheating is calling the thermal soak zone, which is about one to two minutes. Thermal soaking briefly stabilizes the paste and stimulates the fluxes. If the temperature is too high, the components may splatter or oxidize, so the oven is used to regulate a narrow range of heat. The range must be narrow because too low a temperature won't stimulate the fluxes enough.
The re-flow zone, or "time above liquidus" (TAL), is the peak temperature stage. This is usually a temperature 20 to 40 degrees Celsius above liquidus. The appropriate temperature is determined by the component that has the lowest heat tolerance.
The temperature will never exceed 60 degrees Celsius in the machine because the parts inside may burn up at that point. The time above liquidus (TAL) comes to play in determining the required length of time of this stage that will properly meld the component together. Incomplete TAL may cause the paste to stay dry instead of melting, thus creating a defective connection.
The re-flow oven finishes the entire molding process in its cooling stage. The melted paste between the components need to cool gradually to create a cohesive unit. If the component isn't cooled with proper measures, the unit might produce intermetallic accumulation or even go into thermal shock. Proper cooling actually requires a faster temperature change rate than heating for it to achieve the best durability. This faster cooling rate usually lies around 4 degrees Celsius per second.
Re-flow soldering is most often used to fix surface mounted components onto circuit boards. Through-hole components can be fixed onto the boards using this method as well. In order to ensure accuracy, a paste made from solder and flux is set between the component and contact pad. The combined piece then requires a higher temperature for the paste to meld. In order to do this safely, the piece is put inside this kind of soldering machine.
Cautious care needs to be taken so that the electrical component isn't overheated or damaged, so these machines are utilized to slowly and progressively melt the solder paste into a mold. There are four gradual stages of temperature the machine goes through in total. The device goes from preheating, soaking, re-flow melting, then cooling.
The longest stage of the soldering machine is the first preheating feature. Between 1 to 3 degrees Celsius rises per second through the entire time. This gradual increase by a static number of degrees Celsius is often referred to as ramp-up rate. The ramp-up rate is an important feature the machine offer so that the intensity of heat on the component is safely progressive rather than abrupt.
The second stage after preheating is calling the thermal soak zone, which is about one to two minutes. Thermal soaking briefly stabilizes the paste and stimulates the fluxes. If the temperature is too high, the components may splatter or oxidize, so the oven is used to regulate a narrow range of heat. The range must be narrow because too low a temperature won't stimulate the fluxes enough.
The re-flow zone, or "time above liquidus" (TAL), is the peak temperature stage. This is usually a temperature 20 to 40 degrees Celsius above liquidus. The appropriate temperature is determined by the component that has the lowest heat tolerance.
The temperature will never exceed 60 degrees Celsius in the machine because the parts inside may burn up at that point. The time above liquidus (TAL) comes to play in determining the required length of time of this stage that will properly meld the component together. Incomplete TAL may cause the paste to stay dry instead of melting, thus creating a defective connection.
The re-flow oven finishes the entire molding process in its cooling stage. The melted paste between the components need to cool gradually to create a cohesive unit. If the component isn't cooled with proper measures, the unit might produce intermetallic accumulation or even go into thermal shock. Proper cooling actually requires a faster temperature change rate than heating for it to achieve the best durability. This faster cooling rate usually lies around 4 degrees Celsius per second.
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